What are the features of MMC and why it stands out
What are the features of MMC and why it stands out
Artificial intelligence has raised higher demands on bandwidth, port density, and power consumption efficiency. Traditional MPO cabling solutions face new challenges in terms of port space utilization, fiber connection density, and thermal management. With smaller connector size, higher fiber density, and more flexible cabling capabilities, MMC has gradually become an important optical interconnection solution for CPO architecture, high-density distribution systems, and large-scale AI clusters, providing a more efficient fiber connection infrastructure for the next-generation data center.
How does MMC patch cord enhance the cabling efficiency of AI data centers
--Port density: The MMC adopts a very small form factor (VSFF) connector design, enabling a port density approximately 3 times higher than traditional MPO solutions within the same panel area. Take a 5U switch as an example, it can support up to 512 800G port interconnections, greatly improving the space utilization rate of cabinets and patch panels.
--High reliability design: The MMC connector adopts an 8° APC end face technology, achieving a maximum single-mode return loss of up to 60dB, effectively reducing optical reflection interference. It supports a plug & unplug lifespan of 500 times, and meets the long-term stable operation requirements of AI data centers.
--Optimized wiring: MMC patch cords adopt a 2.5mm thin diameter structure, which provides better flexibility and bending performance, reducing cable stacking and entanglement issues. This will surely make cabinets more tidy, and also facilitating heat dissipation and maintenance management.
--Ultra-low insertion loss: Based on TMT Elite™ low-loss ferrule technology, the random interconnection insertion loss of MMC is as low as 0.35dB, which is very crucial to 800G/1.6T high-speed link transmissions.
The practical application of MMC jumper in CPO switch
In switches such as SN6800 and SN6810, the optical engine is directly deployed near the switching ASIC, and traditional pluggable optical module cages are now gradually being replaced by ultra-high-density MMC interfaces. This design makes the internal space of the switch more compact, while also posing higher requirements for wiring density and airflow management.
Heat dissipation capability is also a key challenge in CPO architecture. Due to the high integration of the optical engine and the switching chip, the internal thermal density of the device is significantly increased, and the wiring system needs to minimize obstruction to airflow. MMC adopts a small cable diameter of approximately 2.5mm, which provides better air circulation. This will make it more suitable for high-power AI switching platforms.
Prospect
From the perspective of industry development, CPO has become an important technological path for the next generation of AI networks. Compared to traditional pluggable optical module solutions, the CPO architecture can achieve an energy efficiency improvement of approximately 3.5 times, and reduce signal loss and system power consumption caused by electrical connections. As 800G evolves towards 1.6T, high-density, miniaturized, and low-airflow-impedance MMC fiber optic connectivity solutions will gradually become an important infrastructure for AI data centers.
