ELSFP Patch Cable

ELSFP Patch Cable

Solution for CPO ecology
EDesigned for more efficient cooling solution system
Connector of the other end optional MMC/SN-MT/MTP/MPO

                                                                                ELSFP Patch Cable

 

Products Description

ELSFP, as a pluggable external laser source, physically isolates the highly sensitive laser from the core electronic chip, solving the power consumption and heat dissipation problems of traditional pluggable optical modules at ultra-high speeds. It is a key supporting component for the next generation of ultra large scale data center 51.2T/102.4T NPO/CPO switches, high-performance computing (HPC) interconnect networks, and cloud data center Spine/Core layers.

 

ELSFP Optical Connectors are designed to provide optical power from external laser sources to the chip, streamlining system design and maintenance for hyperscale datacenters. It supports hot swappable functionality, significantly reducing data center operation and maintenance costs and business interruption risks.

 

FSG ELSFP

 

                                         (Image from FSG company, contact to delete if any infringement)

 

Key features

 

--Faceplate pluggable form-factor for 102.4T co-packaged optical (CPO) systems

 Targets primarily at CPO applications, for the use of external lasers to provide optical power to the OEs

--A more efficient cooling solution system

 Remove the heat of the co-package ASICs and OEs by placing the ELSFP at the faceplate of CPO systems

--Field-replaceable, pluggable design enhances uptime and operational flexibility in hyperscale environments

 Easy installation and adjustment across multiple system generations, ideal for CPO, NPO solutions

 

   Product Specifications

               

         Fiber type                                                   SM or PM fiber
         Connector                                      ELSFP to optional  MMC / SN-MT / MPO/MTP
         Fiber counts                                                       12F, 24F
         Insertion loss                                                       ≤0.35dB
         Return Loss                                                       ≥55dB
         PER                                                       ≥20dB
         Durability                                                       GR-1435 ( minimum 100 mating cycles)
         Operating temperature (℃)                                                      -40 to 70℃
         Storage temperature (℃)                                                      -40 to 70℃

 

 

Application Scenarios

• Co-Packaged Optical (CPO) system
• Network interface card
• Switches

elsfp concept

 

 

 

FAQ

 
Q: What Is ELSFP standard?
 A: The product follows OIF-ELSFP-02.0. defining a form factor optimized for external lasers delivering continuous wave (CW) light to optical transceivers co-packaged within a system.

 

Q: What is the difference between ELSFP and traditional SFP?
 A:
ELSFP is an "external light source module" that only emits laser light; Traditional pluggable optical modules are "transceiver integrated", integrating lasers, modulators, and receivers together
 

 

Q: What is the advantage of ELSFP?
 A: ELSFP Solves the three core pain points of high-speed optical interconnection: heat dissipation, maintenance, and cost.

 

 

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